The North News
New Delhi, August 12
Union Cabinet has cleared four new semiconductor manufacturing projects worth ₹4,600 crore, with facilities to be set up in Punjab, Odisha and Andhra Pradesh. The approval, given on Tuesday under the India Semiconductor Mission (ISM), is aimed at strengthening the country’s growing chip-making ecosystem. The projects are expected to create over 2,000 direct skilled jobs and spur indirect employment in electronics manufacturing.
The four ventures — from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies — will take the total number of approved ISM projects to 10, involving cumulative investments of about ₹1.6 lakh crore across six states.
State-wise projects
- Punjab: CDIL will expand its Mohali facility to produce high-power semiconductor devices such as MOSFETs, IGBTs, diodes and transistors in both silicon and silicon carbide. The plant will have an annual capacity of 158.38 million units, serving automotive electronics, renewable energy, industrial applications and EV charging infrastructure.
- Odisha: Two projects are planned in Bhubaneswar’s Info Valley. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will establish India’s first commercial compound semiconductor fabrication plant for silicon carbide devices, with a capacity of 60,000 wafers and 96 million packaged units per year. 3D Glass Solutions Inc. will set up an advanced packaging and embedded glass substrate facility, capable of producing 69,600 glass panel substrates, 50 million assembled units and 13,200 3DHI modules annually.
- Andhra Pradesh: ASIP Technologies, partnering with South Korea’s APACT Co. Ltd., will create a semiconductor packaging unit with a capacity of 96 million units per year for applications in mobile phones, set-top boxes and automobiles.
